德律SPI锡膏检测机

Imaging Method

Dynamic Imaging

Camera

4 Mpix

Imaging Resolution

10 µm or 15 µm (factory setting)

Lighting

RGB LED

3D Technology

2-way Digital Fringe Pattern

Field of View

4 Mpix@ 10 µm: 20 x 20 mm
4 Mpix@ 15 µm: 30 x 30 mm

Imaging Speed

4 Mpix@ 10 µm: 90 cm²/sec
4 Mpix@ 15 µm: 200 cm²/sec

Height Resolution

0.4 µm

Max. Solder Height

@ 10 µm: 420 µm
@ 15 µm: 385 µm

X-Axis Control

Linear Motor and linear scale with DSP-based controller

Y-Axis Control

Ballscrew + AC-servo controller

Z-Axis Control

Ballscrew + AC-servo controller

X-Y Axis Resolution

0.5 µm

Z-Axis Resolution

1 µm

Max PCB Size

510 x 460 mm*

PCB Thickness

0.6-5 mm

Max PCB Weight

3 kg

Top Clearance

40 mm

Bottom Clearance

40 mm

Edge Clearance

3 mm

Conveyor Height

880 – 920 mm

WxDxH

1220 x 1663 x 1620

Weight

920 kg